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“The common request we’ve received from customers in the past few years is that as PCB and package designs become more complex, the minimum geometry is getting smaller, and you are getting more layers of the package, which naturally puts a lot of stress on the substrate,” says Gu. The never-ending trend towards smaller, faster, low-power, and cheaper electronics products, continues to be among the biggest challenges that designers face.
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We want to expand to a much bigger area, from chip, PCB and package, to cars and aerospace.” “A chip is a complex system, but only in one domain. Our goal is to transform electronic design automation to system design automation,” says Ben Gu, vice president of R&D for multi-physics system analysis at Cadence. “Three years ago, we started on a mission to expand our design and analysis capability beyond chip-package-PCB and into system design and analysis. Over the past 30 years, Cadence has grown from being an EDA provider into an Intelligent System Design provider delivering hardware, software, and IP for electronic design. is a leading provider of EDA technologies and solutions for semiconductor and systems companies, offering the broadest, most integrated end-to-end solution to help today’s electronic designers do their best work when creating tomorrow’s products for silicon design creation, simulation, implementation and signoff of analog and digital circuits off-the-shelf design IP and IC packaging, including machine learning (ML)-enhanced EDA tools and ML-enabled EDA flows.
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Cadence Sigrity X has been honored with the Best EDA Product of the Year award at the inaugural EE Awards Asia.Ĭadence Design Systems, Inc.